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High Frequency pcb manufacturer

Alcanta PCB is one of the High Frequency pcb manufacturers.High frequency electronic equipment is the development trend, especially in wireless network. With the rapid development of satellite communication, information products are developing to high speed and high frequency. Therefore, the development of new products always needs to use high frequency PCB, satellite system, mobile phone receiving base station, etc., these communication products must use high-frequency PCB.

High Frequency pcb manufacturer
High Frequency pcb manufacturer

With the increasing complexity of electronic components and switches, faster signal flow rates continue to be required and therefore higher transmission frequencies are required. Due to the short rise time of pulses in electronic components, it is necessary to treat the conductor width as an electronic component in HF technology.

Depending on the parameters, the HF signal is reflected on the circuit board, which means that the impedance (dynamic resistance) changes relative to the transmitting component. To prevent such capacitive effects, all parameters must be specified accurately and implemented with the highest level of process control.

The key impedance in the high frequency circuit board is the main conductor trace geometry, the layer is formed, and the dielectric constant (dielectric constant ε R) of the material used.

High frequency boards for wireless applications and data rates above GHz have special requirements for the materials used

  1. Dielectric constant.
  2. Low attenuation, effective signal transmission.
  3. Uniform structure, low tolerance of insulation thickness and dielectric constant.

Generally speaking, high frequency can be defined as frequency above 1GHz. At present, PTFE materials are widely used in high frequency PCB manufacturing, also known as Teflon, whose frequency is usually higher than 5GHz. In addition, FR4 or PPO substrates can be used for product frequencies between 1GHz and 10GHz. These three high frequency substrates have the following differences:

With regard to the laminate costs of FR4, PPO and Teflon, FR4 is the cheapest and Teflon is the most expensive. In DK, DF, water absorption and frequency characteristics, Teflon is the best. When the frequency of product application needs to be higher than 10 GHz, we can only choose Teflon PCB substrate for manufacturing. The performance of Teflon is much better than other substrates, but it has the disadvantages of high cost and high heat resistance. In order to improve the stiffness and heat resistance of PTFE, a large amount of SiO2 or glass fiber is used as filling material. On the other hand, due to the molecular inertia of PTFE material, it is difficult to combine with copper foil, so special surface treatment is needed on the bonding side.



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