FR4 is a glass epoxy laminate, most commonly used in PCB (printed circuit board). It is used in various flexible printed circuit boards and other semi-rigid variants. It shows excellent high strength and flame retardancy. Easy to integrate applications and allow component installation make it the preferred material for most PCBs.
FR4 circuit board manufacturing
Fiberglass board is impregnated with epoxy resin. These sheets are used to build the FR4. Eight of these reinforcements are covered with copper foil. The entire structure is then placed in a press and then bonded to a FR-4 sheet.
Materials used to fr4 circuit board manufacturing
The glass in the FR-4 plate makes it very strong. Unless otherwise specified, the epoxy resin used is usually flame retardant. Bromine is used to impart flame retardancy to epoxy resins. This makes the whole PCB flame retardant. This is critical in most applications associated with high temperatures.
The copper used helps designers and manufacturers to etch patterns onto PCB. These etched patterns form the basic circuits that connect the various components. It also connects the interconnector to the basic circuit. The interconnector is used to connect the layers of a PCB.
Dicyandiamide, also known as “dice”, is the most commonly used material to harden epoxy resins. The maximum allowable temperature is 300 ℃. If a phenolic material is used to cure epoxy resin, it is called “non succinic acid”. Its maximum temperature tolerance is 350 ℃.
The FR-4 can be used for single or multi-layer PCB of surface mount components. From a manufacturing point of view, the FR-4 is easy to use. Therefore, it provides designers with great flexibility to take advantage of the inherent characteristics of materials, thus bringing benefits to applications and processes.