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ALCANTA PCB is one of the Buried pcb manufacturer.It has many years of experience in manufacturing printed circuit boards using blind and buried Vias. No matter what measures are taken, we can completely mask or bury the PCB required for your application.

Buried pcb manufacturer
Buried pcb manufacturer

The following table shows the design parameters of blind and buried Vias produced by pcbart.

Through Via type through Via diameter

Buried vias pcb manufacturer
Buried vias pcb manufacturer

In the field of printed circuit board manufacturing, you may have heard of the terms blind Via and buried Via. What are blind PCB vias or buried PCB vias, and what do they mean for your project? To understand the answer, first of all, we need to understand the through Vias associated with printed circuit boards.

What is a through Via?

Through Vias are copper plated Vias on printed circuit boards, which can be used to connect layers. Standard vias are called through-Vias, but there are several drawbacks to using vias in Surface Mount Technology (SMT). Therefore, we often use blind or buried Vias. Blind or buried vias can be treated by a variety of methods, including copper mask via, solder mask via, electroplated via or staggered via.

What is buried Via?

In the buried through-Via, only the inner layer of the plate is connected through the through-Via. It’s “buried” on the board and can’t be seen from the outside.

What is a blind Via?

In the blind Via, the through Via connects the outer layer to one or more inner layers of PCB, and is responsible for the interconnection between the top layer and the inner layer.

Blind Vias and buried through Vias are particularly beneficial in HDI PCB because they can optimize the density of the circuit board without increasing the board size or the number of circuit board layers required.

Advantages and disadvantages of Buried vias pcb

Blind Via and buried via have their advantages and disadvantages in PCB design. The advantage, of course, is that the technology provides a viable design technique that helps to meet the density limits of lines and pads on a typical design without increasing the number of layers or board size. The disadvantage of this technology is that the cost of a plate with blind Vias and / or buried through Vias is significantly higher than that of a typical multi-layer board with the same number of layers due to the additional operations required to manufacture the board.

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