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ALCANTA TECHNOLOGY
At the heart of our business lies the research, development, production, and sale of PCBs. Our production capabilities encompass the full range of PCB manufacturing, including HDI, multilayer, rigid-flex, heavy copper, metal-based, high-frequency, and flexible boards, as well as packaging substrates. We have a global sales footprint, serving key sectors such as industrial control, medical electronics, automotive electronics, and telecommunication equipment.
We not only produce various types of PCBs to meet the specific demands of our customers but also utilize advanced MSAP and SAP technologies. We manufacture FC BGA Packaging Substrates from 4 to 16 layers using ABF base materials, achieving minimal gaps and trace sizes of 9um/9um. Our product range includes a 10-layer FC BGA packaging substrate with ABF base materials, demonstrating our dedication to providing cutting-edge solutions and the highest quality in PCB technology.
Your dependable partner in PCB production
ALCANTA delivers cutting-edge technology in circuit board production, PCB assembly, and packaging substrates, all while maintaining the utmost quality standards. From prototypes and small batches to large-scale orders, and from straightforward PCB layouts to multifaceted designs, ALCANTA stands as a trusted provider to fulfill and surpass your requirements.
Customized production PCB process
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